– Plane measurement, full coverage, large FoV: 62*62mm, measurement without any blind spots

– High-precision 3D measurement, Measurement accuracy: ±20μm,Repeatability: 1μm

– Inline measurement, 2D color image and 3D point cloud can be obtained simultaneously

– Extremely fast computing, high-precision measurement of 2D dimensions and 3D profile within one second

-Integrated design, complete SDK and software support

– Be applied in intelligent manufacturing, precision measurement and scientific research

Technical parameters

Model HPS-DBL60 Image sensor 10 megapixel CMOS sensor
2D/3D image 3200*3200(1600*1600)pixels 2D/3Dimage XY data interval 19.7μm(39.4μm)
Repeatability(σ)① 1μm② Measurement accuracy ③ ±20μm
Field of view 62*62mm Measurement range ±6.5mm
Shutter speed 50μs~200ms WD (up to the reference


Light source LED (red, green, blue), can be set separately to 100 levels Connection target HPS-NB3200
LED display Power supply, operation mode Power voltage & current consumption 24 VDC±10%,3A
Operating temperature 0-40° Relative humidity 20-85%RH (no condensation)
Dimensions 276*276*290mm Weight 9.8kg

*①Using 3*3 averaging filter and a Hypersen reference workpiece;

*②Repeatability at the center of FoV (60 mm type: 30*30 mm at the center, 24 mm type: 12*12mm at the center);

*③Using a Hypersen height difference gauge. 60 mm type: height difference of 2 mm and width of 20 mm; 24 mm type: height difference of 1 mm and width of 10 mm.

*All technical specifications are subject to the latest official datasheet.

*Hypersen reserves the right of final interpretation.

Application field

Profile measurement

Edge detection

Defect detection

Dimensions measurement

3D geometric measurement

Depth and angle measurement

Product size